- Pad : The metal on the surface of a substrate or PWB through which the hole is drilled for a via connection, or the conductor point designed to be a test probe landing area. - Peel-Away Speed : The speed of lifting the stencil from the PCB after printing - Percent Area Coverage : The percentage of footprint area that has been covered by the printing process - Pick & Place : The method of certain placement equipment of picking components (mechanically or by vacuum) from tapes or magazines (etc.) and placing them in the correct position of the PCB. - Pitch : The distance between a feature and the adjacent feature on the same component. - Placement Machine : (Automatic) equipment used to mount components onto a PCB - Plastic flat-pack : A FP with the body made with plastic - PLCC (PCC) : Plastic Leaded Chip Carrier (Plastic Chip Carrier). A plastic IC package for surface mounting applications that has leads, generally "J" leads, on all four sides. - Poise : Unit of viscosity. It is one for a liquid that requires the force of one dyne to be moved from a one square centimeter surface area with velocity of one centimeter per second. - Polymers : A class of chemical whose main feature are the long chains of molecules. Epoxies and other resins are polymers - Preheat : it evaporates the solvent component of the flux (95 to 99% of its action takes place right in the wave). Its main function is to raise the board’s temperature. - Preproduction Test Board : An assembly that is to determine whether a sub-contractor is able to build the product in large runs. - Primer : A first coating that is applied to improve the holding strength of an adhesive - Print Head : That part of a printer that contains all the elements for holding the squeegee - Printed Circuit Board [PCB] : General designation of the support structure of an electronic assembly. Also referred to as a PWB [Printed Wire Board]. It consists essentially of a dielectric material (the substrate) onto which metallic conductors have been applied (etched copper foil and additional plating) to reflect the electronic circuit. - Pyrometer : IR detector to measure the temperature of the board

Innovative Entwicklungen von SEHO bei der SMT in Nürnberg

SEHO stellt mehrere Neuheiten aus allen Produktbereichen vor
mehr ...

Prozesskontrolle mit innovativen Software-Features

Die Selektiv-Lötsysteme von SEHO bieten viele Features zur Prozesskontrolle
mehr ...

Neue Technologie zum Löten ohne Lunker

SEHO stellt eine neue Technologie vor, mit der ein nahezu lunkerfreies Lötergebnis
mehr ...

SEHO spendet Zeichenplatten an Johannes-Hartung-Realschule Miltenberg

Die SEHO Systems GmbH hat 20 Zeichenplatten im Format A4
mehr