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FDS Technology
Efficient Energy Transfer in Reflow Soldering The Flow Dynamic System FDS from SEHO stands for the optimized heat transfer during reflow soldering. The particular construction of the process chamber and of the convection modules combined with SEHO's tangential blower technology, results in the controlled circulation of the process gas which leads to an optimized heat transfer into each individual assembly. A high circulated process gas volume and slot nozzles which are specifically adapted to the flow conditions ensure an extremely homogeneous temperature spread at simultaneously moderate flow speed. This concept allows a high board-level turbulence. This produced turbulence offers various advantages: Most important is the fact that high turbulence provides the best heat transfer situation, much more efficient than a laminar flow. Better thermal mixing of the process gas is one of the reasons for improved performance. This enables low and component-sensitive temperatures, even in case of high-temperature-solders, as for instance lead-free solder pastes. Moreover, the randomization of the gas vectors eliminates the drag force or shadow formation, feared in laminar flow. Thus, the FDS module can operate at higher gas volumes without displacing of components, observed in other convection concepts. The user benefits from this technological development greatly. The FDS design creates a very good heat transfer coefficient so that the set temperatures of the oven can remain on lower level. This helps a lot to fulfil today’s requirements concerning the narrow process window of the leadfree soldering process. All the components will be soldered whereas the temperature impact on the components with small thermal mass will be reduced significantly.
- Optimized heat transfer |
