To realize optimum soldering results, the particular process conditions have to be met.

To a high degree, process reliability depends on:

     •  the design of the pads (type, distance between each other)
     •  the distance between pad and neighboring component pad
        (e.g. SMD which is not supposed to be touched)
     •  the pin length underneath the board
     •  the pitch between pins (e.g. pitch of connectors)

These influence coefficients effect directly the peel-off of the flowing solder. To ensure no-bridging results, a defined and reproducible peel-off is required. Bridges are the main soldering failure (more than 80 %).

Basically, it has to be distinguished between drag soldering process with a miniwave and dip soldering processes. Each process demands a special PWB design.

The design guidelines, which are available for you here in the download area, ensure the best possible process conditions. In case you should decide not to follow these recommendations, the all-over process window will be smaller and additional steps will be required to stabilize the process. These additional steps could demand higher maintenance requirements and an increased wear of tooling parts.