To realize optimum soldering results, the particular process conditions have to be met.

To a high degree, process reliability depends on:

     •  the hole to pin ratio
     •  the pad diameter
     •  component clearance

Our recommended design guidelines which are available for you to be downloaded, ensure the best possible process conditions. In case you should decide not to follow these recommendations, the all-over process window will be smaller and additional steps will be required to stabilize the process. Of course, an influence on the soldering result cannot be excluded.