We continue to see strong demand for leaded soldering from our military and aerospace customers,” said Gary Walker, President of JAVAD EMS. “The SEHO PowerWave gives us a more capable process with better control and consistency, while increasing our capacity to support that growth.”

The PowerWave features an HVLP spray fluxer that provides uniform flux coverage while reducing flux consumption, configurable preheating zones for a variety of board designs, and advanced solder nozzle technology that helps produce reliable solder joints. Its modular design also provides the flexibility to accommodate a broad range of production requirements.

The addition of the SEHO system gives JAVAD EMS greater flexibility for through-hole production while providing customers with a more robust leaded soldering process as demand for these assemblies continues to grow.

JAVAD EMS provides electronics manufacturing services including SMT and through-hole PCB assembly, box build, testing and supply chain support for customers in the medical, industrial, military, aerospace and commercial markets.

For more information, please visit www.javadems.com.

As part of a joint project, SEHO is currently working with CERN on a prototype system for a key process step in the production of non-insulated coils made from high-temperature superconductors. These superconductors are considered as a key technology for high-performance, highly compact magnetic coils that will enable unprecedented magnetic field strengths in future particle accelerators, while also increasing efficiency.
The project is part of the MuCol (Muon Collider) program coordinated by CERN and thus makes an important contribution to the development of the next generation of accelerator technologies.

For many years, ANS has been one of the established full-range suppliers of SMD manufacturing equipment and has extensive experience in the planning and implementation of complete production lines.
Sales responsibility for customers in Austria and Switzerland will now be taken over by Levent Akbulut from ANS. He is highly familiar with SEHO’s equipment, processes and market requirements, and has more than 27 years of experience in the electronics industry, including almost 19 years with SEHO Systems GmbH. His long-standing practical experience on both equipment and process level provides the foundation for providing competent and solution-oriented consulting regarding SEHO’s soldering processes and automation technology.

“SEHO’s systems are an ideal addition to our product portfolio. By extending the partnership to Austria and Switzerland, we can now provide comprehensive support to electronics manufacturers in these countries with the implementation of modern, complex SMT and THT manufacturing concepts,” explains Sebastian Glitsch, Managing Director of ANS answer elektronik GmbH.

SEHO also sees the expanded cooperation as an important step forward. “Previous joint projects have shown that our respective areas of expertise result in strong synergies for our customers. With ANS and Levent Akbulut’s many years of experience, our customers in Austria and Switzerland have access to a contact person with profound process know-how and high application competence,” says Rainer Dries, Sales Coordinator SEHO Systems GmbH.

The shared objective is to support electronics manufacturers in both countries in implementing efficient, stable, and future-proof manufacturing processes and to provide them with complete line solutions from a single source.

A breakthrough for a process step that was previously impossible to monitor

The application of flux in wave and selective soldering is a key process step, but one that has been difficult to control until now. Too little flux leads to soldering errors such as incomplete penetration or cold solder joints, while too much can cause residues that can impair the function of the assembly.
Previous monitoring methods are generally based on random sampling or purely functional checks of the fluxer. They therefore do not provide any information about the actual application on the individual printed circuit board.