We continue to see strong demand for leaded soldering from our military and aerospace customers,” said Gary Walker, President of JAVAD EMS. “The SEHO PowerWave gives us a more capable process with better control and consistency, while increasing our capacity to support that growth.”

The PowerWave features an HVLP spray fluxer that provides uniform flux coverage while reducing flux consumption, configurable preheating zones for a variety of board designs, and advanced solder nozzle technology that helps produce reliable solder joints. Its modular design also provides the flexibility to accommodate a broad range of production requirements.

The addition of the SEHO system gives JAVAD EMS greater flexibility for through-hole production while providing customers with a more robust leaded soldering process as demand for these assemblies continues to grow.

JAVAD EMS provides electronics manufacturing services including SMT and through-hole PCB assembly, box build, testing and supply chain support for customers in the medical, industrial, military, aerospace and commercial markets.

For more information, please visit www.javadems.com.

As part of a joint project, SEHO is currently working with CERN on a prototype system for a key process step in the production of non-insulated coils made from high-temperature superconductors. These superconductors are considered as a key technology for high-performance, highly compact magnetic coils that will enable unprecedented magnetic field strengths in future particle accelerators, while also increasing efficiency.
The project is part of the MuCol (Muon Collider) program coordinated by CERN and thus makes an important contribution to the development of the next generation of accelerator technologies.

A breakthrough for a process step that was previously impossible to monitor

The application of flux in wave and selective soldering is a key process step, but one that has been difficult to control until now. Too little flux leads to soldering errors such as incomplete penetration or cold solder joints, while too much can cause residues that can impair the function of the assembly.
Previous monitoring methods are generally based on random sampling or purely functional checks of the fluxer. They therefore do not provide any information about the actual application on the individual printed circuit board.